KEYENCE JAPAN VHX-7000 4K Ultra-High Accuracy Microscope
							
								Automatically output 3D test report
								Ring-shaped light and bottom light
								Dust cleanliness detection
								Maximum area measurement
								Check the pins for copper leakage
								Check the surface for sanding marks
								Automatic measurement of various areas: shell thickness angle, pin length and
								width,
								sphere diameter, etc.
								Roughness detection (compare the RA value on the surface of the shell to judge the
								process consistency, compare the test consistency of the front and back of the
								shell, compare the smoothness of the pins to judge the degree of oxidation,
								etc.)
								3D automatic stitching, on the basis of 2D stitching, the depth of field synthesis
								function is added to compare whether the process of the front and back of the chip
								is the same.