KEYENCE JAPAN VHX-7000 4K Ultra-High Accuracy Microscope
Automatically output 3D test report
Ring-shaped light and bottom light
Dust cleanliness detection
Maximum area measurement
Check the pins for copper leakage
Check the surface for sanding marks
Automatic measurement of various areas: shell thickness angle, pin length and
width,
sphere diameter, etc.
Roughness detection (compare the RA value on the surface of the shell to judge the
process consistency, compare the test consistency of the front and back of the
shell, compare the smoothness of the pins to judge the degree of oxidation,
etc.)
3D automatic stitching, on the basis of 2D stitching, the depth of field synthesis
function is added to compare whether the process of the front and back of the chip
is the same.