External Visual InspectionAppearance test refers to
confirming the number of chips received,inner packaging,Humidity indicator,Desiccant requirements and
appropriate outer packaging。Second, the appearance inspection of a single chip,mainly include:Chip
typing,years, Country of origin,Whether to recoat,Pin status,Are there any re-sand marks,Unknown
residue,factorylogos position
ProgrammingWe use support to detect208EachIC Produced by the
manufacturer47000SpeciesICModel programming device。Provided include: EPROM,Parallel and
serialEEPROM,FPGA,Configure serialPROM,Flash memory, BPROM,NOVRAM,SPLD,CPLD,EPLD,Microcontroller,MCUAnd
standard logic device testing。
X-RayX-rayTesting is a real-time non-destructive analysis to check the hardware
components inside the component,Mainly check the lead frame of the chip,Wafer size,Gold wire binding
diagram,ESDDamage and holes, Customers can provide usable samples or previous purchases for comparison
check。
Baking and Dry PackingOur services also includeJ-STD-033B.1.For standard professional baking and
vacuum packaging,This service protects the chip from moisture,Controlling solder reflow temperature,Keep the
chip available and reliable。
Electrical and Temperature TestingWe provide extensive chip functional tests,From basic parameters to
basisMilSTD883Confirm chip function,Especially complex chips such asFPGA, CPLD and PLA。
Soderability TestThe test standard for solderability test isJ-STD-002B,This test mainly tests
whether the soldering ability of the chip pins is up to standard。
DecapsulationOpen the
lid(Unblock)Mainly use the instrument to corrode the package on the chip surface,Check for wafers
inside,Wafer size,Manufacturer's logo,Copyright year,Wafer code,Can determine the authenticity of the
chip。
Pin Correlation Testaccording todatasheetDevice pins and related descriptions specified by Chinese
manufacturers,Using a semiconductor tube characteristic plotter,Through the open road、Short-circuit test to
check the chip for damage。